Ansys Icepak

Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.

Icepak Simulation Software

Electronics Cooling & PCB Thermal Simulation and Analysis

For thermal and fluid flow studies of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies, Ansys Icepak offers powerful electronic cooling solutions that use the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver. The graphical user interface for Icepak’s CFD solver is Ansys Electronics Desktop (AEDT) (GUI).

  • Unstructured, Body-fitted Meshing
  • High-fidelity CFD Solver
  • Comprehensive Thermal Reliability Solution
  • Industry Leading Multiscale Multiphysics

Ansys Icepak Key Features

Meet Ansys’ industry-leading computational fluid dynamics (CFD) solutions.  In addition, chip-level thermal integrity simulation tools, offering engineers everything required to conduct electronics cooling simulation.  This includes, thermal analysis for chip-package, PCB, and systems-level simulations.

Moreover, engineers may also perform a thermomechanical stress analysis and corresponding airflow analysis’.  Crucially, this ensures designers can find the best heat sink or fan type for your needs. Finally, users can undertake design trade-offs with our streamlined workflow, resulting in increased reliability and performance.

Icepak can reliably predict temperature rise using specific geometries and electrical inputs.  That is, thanks to a tight synergy with SIwave, Ansys Mechanical, and Sherlock.

Icepak users can quickly put together automated workflows for electromigration and dielectric breakdown.  In addition, multi-axial solder joint fatigue within the Ansys ecosystem.

Electronic devices’ efficiency and reliability can be harmed by heat.

Thermal analysis relies heavily on IC power dissipation and power losses across the board.

Ansys Electronics Software