Ansys Icepak

Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.

Electronics Cooling & PCB Thermal Simulation and Analysis.

For thermal and fluid flow studies of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies, Ansys Icepak offers powerful electronic cooling solutions that use the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver. The graphical user interface for the Ansys Icepak CFD solver is Ansys Electronics Desktop (AEDT) (GUI).

  • Unstructured, Body-fitted Meshing
  • High-fidelity CFD Solver
  • Comprehensive Thermal Reliability Solution
  • Industry Leading Multiscale Multiphysics

Resonant mode simulation with SIwave software

Ansys Icepak Key Features

Electronics Cooling

Ansys’ industry-leading computational fluid dynamics (CFD) solutions, as well as chip-level thermal integrity simulation tools, offer you everything you need to conduct electronics cooling simulation and thermal analysis for chip-package, PCB, and systems.

You may also perform a thermomechanical stress analysis and an airflow analysis to find the best heat sink or fan for your needs. You can undertake design trade-offs with our streamlined workflow, resulting in increased reliability and performance.

Thermal Reliability

Icepak can reliably predict temperature rise using specific geometries and electrical inputs thanks to a tight synergy with SIwave, Ansys Mechanical, and Sherlock.

Icepak users can quickly put together automated workflows for electromigration, dielectric breakdown, and multi-axial solder joint fatigue within the Ansys ecosystem.

Electrothermal Analysis of a PCB

Electronic devices’ efficiency and reliability can be harmed by heat.

Thermal analysis relies heavily on IC power dissipation and power losses across the board.