Ansys Slwave Key Features
Slwave supports a variety of extraction types. Including, signal and power RLCG IBIS for IC packaging, touch panel RLCG unit cells, bus bar RLCG, power inverter/converters. In addition, a dedicated thin-plane solution for touch panel extractions.
Automatic and configuarbale EMI deisgn rule checks are readily provided by an EMI Scanner and EMI Xplorer. Crucially, this ensures swift detection for regions of potential interference on the design prior to simulation.
Ansys Slwave offers a DDR virtual compliance package that, when used in conjunction with the DDR Wizard, delivers end-to-end virtual compliance for DDR-based designs. In addition, our new SPISim Technology makes compliance reporting for USB-C and COM calculations for IEE 802.3bj and 802.3bs channels a breeze. Moreover, customization and assistance are also possible in the programming environment. This is only the scratching the surface of Ansys SIwave capabilities and integrations.
Using DC power loss from Ansys Slwave as a heat source, this multiphysics approach provides realistic thermal modeling of IC packages and PCBs. Remarkably, Icepak overcomes the difficulties of dissipating thermal energy from electronic components. Which, if left unattended, can lead to component failure due to overheating.
After that, you can use Ansys Mechanical to calculate thermal stress. Ultimately, this multiphysics technique enables you to do a linked EM-thermal-stress analysis before production to gain a thorough understanding of the design.