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Ansys SIwave

SIwave models, simulates and validates high-speed channels for modern high-performance electronics.

Ansys SIwave

Ansys SIwave Capabilities

Ansys SIwave dynamically links circuit and system simulations using powerful electromagnetic, thermal, and mechanical simulators.  As most EEM engineering are aware, Co-analysis of power integrity, signal integrity, and thermal integrity is required for the successful design of next-generation electronic products.

Die-to-Die SoC Implementation

Thankfully, Ansys Slwave uniquely preforms die-to-die connectivity design across ICs, packages, connectors, and boards. With shorter time to market, lower costs, and greater system performance, Slwave helps customers gain a competitive advantage.

Ansys Slwave Key Features

Slwave supports a variety of extraction types.  Including, signal and power RLCG IBIS for IC packaging, touch panel RLCG unit cells, bus bar RLCG, power inverter/converters.  In addition, a dedicated thin-plane solution for touch panel extractions.

Automatic and configuarbale EMI deisgn rule checks are readily provided by an EMI Scanner and EMI Xplorer.  Crucially, this ensures swift detection for regions of potential interference on the design prior to simulation.

Ansys Slwave offers a DDR virtual compliance package that, when used in conjunction with the DDR Wizard, delivers end-to-end virtual compliance for DDR-based designs. In addition, our new SPISim Technology makes compliance reporting for USB-C and COM calculations for IEE 802.3bj and 802.3bs channels a breeze.  Moreover, customization and assistance are also possible in the programming environment.  This is only the scratching the surface of Ansys SIwave capabilities and integrations.

Using DC power loss from Ansys Slwave as a heat source, this multiphysics approach provides realistic thermal modeling of IC packages and PCBs.  Remarkably, Icepak overcomes the difficulties of dissipating thermal energy from electronic components.  Which, if left unattended, can lead to component failure due to overheating.

Linked EM-Thermal Stress Analysis

After that, you can use Ansys Mechanical to calculate thermal stress.  Ultimately, this multiphysics technique enables you to do a linked EM-thermal-stress analysis before production to gain a thorough understanding of the design.

  • Strong demand from chip customers to provide AMI
    models for SerDes IP
    – Considered part of doing SerDes IP business today
    – Systems customers of those chips strongly demand AMI to support simulation efforts
  • Enables up-front feasibility analysis with customer
    channels during pre-sales phase
  • Strong AMI IP Library base to work from
    – Many top-level modules for SerDes equalization can be leveraged
    – Accelerates turnaround and reduces time-to-customer
  • Enables in-house system simulation for package and test
    board designs

Ansys Electronics Software