Ansys Q3D Extractor 

The 3D and 2D quasi-static electromagnetic field simulations necessary for the extraction of RLCG parameters from an interconnect structure are easily performed by Ansys Q3D Extractor.


Ansys Q3D Extractor Key Features

q3d capability 1

3D Quasi-Static Field Solver

An improved quasi-static 3D electromagnetic field solver based on the method of moments (MoM) is included in Ansys Q3D Extractor, which is accelerated by the fast multipole approach (FMM). The proximity and skin effect, dielectric and ohmic loss, and frequency dependence are among the findings. Q3D Extractor extracts resistance (R), partial inductance (L), capacitance (C), and conductance (G) in three dimensions quickly and effortlessly.


2D Extractor: Cable and Transmission Line Field Solver

Ansys Q3D Extractor includes a powerful quasi-static 2D electromagnetic field solver that employs the finite element method (FEM) to calculate per-unit-length RLCG parameters for cable models, transmission lines, characteristic impedance (Z0) matrices, propagation speed, delay, attenuation, effective permittivity,  differential and common-mode parameters, and near-and far-end crosstalk coefficients.

q3d capability 2

Only geometry, material parameters, and the desired result are required when using automatic adaptive meshing algorithms. The meshing procedure employs a very reliable volumetric meshing technique, as well as multithreading, which reduces memory usage and speeds up simulation time. This tried-and-true technique simplifies the process of creating and modifying a finite element mesh, making advance numerical analysis accessible to employees at all levels.

q3d capability 3

High-Performace Computing (HPC) solutions for electronics offers parallel processing for solving the toughest and most challenging models- models with considerable geometric detail, massive systems, and complex physics.

Mutlithreading: To shorten solution time, Electronics HPC makes use of several cores on a single machine. The initial mesh generation, matrix solutions, and field recovery are all sped up by multithreading technology.

Spectral Decomposition Method: By distributing many frequency points in parallel across computation cores and nodes, the spectrum decomposition technique (SDM) speeds up frequency sweeps. This approach can be used in conjunction with mutlithreading to speed up the extraction of individual frequency points, while SDM parallelizes the extraction of multifrequency points.

HPC in the Cloud: High-performance computing (HPC) is relatively easy to access and use with Ansys Cloud. It was created in partnership with Microsoft Azure, a prominent cloud platform for high-performance computing. Ansys Cloud has been incorporated into Ansys Electronics Desktop, allowing you to tap into unlimited, on-demand computing power right from your design environment.

q3d capability 4

Simulation-Driven Product Development relies heavily on parameterization and optimization. The parametric analysis gives you a complete picture of the design space based on your design factors, allowing you to make smarter engineering decisions. Optimization methods allow the software to find better designs on its own. Parameterization and optimization capabilities include:

Parametric Analysis:

  • Parameters with a user-defined range and number of steps
  • Permutations of parameters are automatically analyzed
  • Data reassembly for parametric tables and studies as well as automated job management across numerous hardware platforms


  • Cost functions and goal targets that can be selected by the user include:
    • Quasi-Newton Method
    • Sequential nonlinear programming (SNLP)
    • Integer-only sequential nonlinear programming

q3d capability 5

Simplorer integrates Ansys Maxwell, Ansys HFSS, Ansys Slwave, and Ansys Q3D Extractor to provide a powerful platform for modeling, simulating, and analyzing system-level digital prototypes. Simplorer lets you test and improves the performance of software-controlled multidomain systems. Simplorer provides wide support for creating and simulating system-level physical models, with flexible modeling options and close integration with Ansys 3D physics simulation, to help you connect conceptual design, thorough analysis, and system verification.

Simplorer is a powerful tool for designing electrified systems, power production, conversion, storage, and distribution, EMI/EMC investigations, and general multidomain system optimization and verification.

q3d capability 6

Ansys Q3D Extractor is perfect for creating IBIS package models since it can generate extremely accurate reduced-order SPICE models for use in circuit simulation. Crosstalk, ground bounce, interconnect delays, and ringing can all be studied in order to better understand the performance of high-speed electronic designs such as multilayer printed circuit boards, sophisticated electronic packages, and 3D on-chip passive components.

Q3D Extractor is also required for extracting correct electrical parasitic of crucial interconnect components in the package (bondwires), on the board (critical nets), and for the chip, package, and board connection path (i.e., connectors, cables, sockets, and transmission lines).

q3d capability 7

To produce similar circuit models for high-speed electronic (SPICE subcircuits/ladder type lumped models), use Ansys Q3D Extractor. The type of model produced by Q3D Extractor is determined by the solver utilized. Simplorer SML, HSPICE Tabular W-Element, PSpice, Spectre, IBIS ICM/PKG models, and Ansys CPP Models are all created by the 2D and 3D field solvers.

q3d capability 8

Ansys Q3D Extractor is perfect for optimizing inverter/converter topologies and minimizing bus inductance, overvoltage situations, and short-circuit currents in hybrid-electric technologies and power distribution applications. The software pulls resistance, partial inductance, and capacitance parasites from high-power bus bars, cables, and high-power inverter/converter modules, then feeds them into Ansys Twin Builder to investigate a power electronic system’s EMI/EMC performance. Electrothermal stress induced by electrical currents can be studied using Ansys Icepak and Ansys Mechanical.

By analyzing the RLCG matrix data of touchscreen devices with Q3D Extractor, you may overcome design issues early in the design phase. The ability to solve thin conductive layers efficiently, such as ITO, can speed up solutions by up to 22 times when compared to standard thick metal solutions.

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