Designers can model interacting optical, electrical, and thermal effects thanks to tools that seamlessly integrate device and system level functionality. A variety of processes that combine device multiphysics and photonic circuit simulation with external design automation and productivity tools are made possible by flexible interoperability between products.
Optical Waveguide & Coupler Solver
Engineers can reliably predict waveguide and coupler performance using MODE. Large planar structures and extended propagation lengths are no problem for MODE, which combines bidirectional Eigenmode expansion, varFDTD, and finite difference eigenmode solvers to deliver accurate spatial field, modal frequency, and overlap evaluations.
Advanced bend loss analysis is offered by Lumerical MODE employing spectrally and spatially resolved imaging.
To determine the differences and similarities between two or more databases or collections as well as the degree of overlap between resources, overlap calculation and analysis are simple to perform.
Multiple stages of analysis throughout the simulation process are necessary to get a reliable final design. With modal area analysis, Lumerical MODE accomplishes this feat.
Enjoy the 3D FDTD accuracy while using 2D simulation times. The 2.5D varFDTD solver in Lumerical MODE can accurately and quickly model massive planar waveguides.
To mimic electromagnetic propagation for long propagation lengths in waveguide or fiber devices, use the Lumerical MODE. Device length and periodicity are automatically surveyed by the software.
Simulation of Nanophotonic Devices
This expertly refined FDTD method (also known as Yee’s Method) offers best-in-class solver performance across a wide range of applications. The integrated design environment offers advanced post-processing, optimization, and scripting capabilities, allowing you to concentrate on your design while leaving the rest to Lumerical FDTD.
Photonic Integrated Circuit Simulator
The photonic integrated circuit simulator from Lumerical, INTERCONNECT, explores and evaluates multimode, bidirectional, and multi-channel PICs (Photonic Integrated Circuit). Engineer’s can use INTERCONNECT’s extensive library of primitive elements and foundry-specific PDK (Process Development Kit) elements when creating projects in the hierarchical schematic editor to conduct statistical analysis in the time or frequency domain.
3D Charge Transport Solver
The engineering tools for detailed charge transport simulation of active photonic and optoelectronic semiconductor devices are readily available in Lumerical CHARGE. The set of equations defining electrostatic potential (Poisson’s equations) and density of free carriers is self-consistently solved by CHARGE (drift-diffusion equations). State-of-the-Art simulation tools for automatic and guided mesh refining are leveraged by engineers to maximize accuracy while requiring the least amount of computational work.
A user-specified time interval is used to compute the transient output variables in Lumerical CHARGE transient analysis section. A DC analysis can automatically determine the beginning conditions. All sources (such as power supply) that are not time-dependent are set to their DC value. Initial conditions are assumed at the start of the analysis rather than the outcome of the DC operating point analysis if Josephson junctions are present or if the UIC option is specified. All sources should start with zero output in Josephson junctions. The transient simulation can be run at each point over a variety of bias settings by combining transient analysis with a DC sweep.
The AC small signal transfer function, input impedance, and output impedance of a network are calculated by Lumerical HEAT’s transfer analysis section. The DC operating point for AC analysis is automatically calculated using an operating point analysis. Moreover, the transfer function can be estimated at each point over a variety of bias circumstances by combining the transfer analysis with a DC sweep.
The poles and/or zeros in the small-signal AC transfer function are computed by the pole-zero analysis section of Lumerical CHARGE. All of the nonlinear components in the circuit’s linearized, small-signal models are then determined after the DC operating point has been calculated. The poles and zeros are then determined using this circuit. The transfer functions (output voltage)/(input voltage) and/or (output voltage)/(input current) are readily accessible for engineers to employ.
The poles and zeros of functions like input/output impedance and voltage gain can be found using these two forms of transfer functions, which cover all circumstances. With resistors, capacitors, inductors, linear-controlled sources, independent sources, BJTs, MOSFETs, JFETs, and diodes, the pole-zero analysis can be applied.
The AC output variables are calculated as a function of frequency by the AC small-signal section of Lumerical HEAT. The program initially calculates the circuit’s DC operating point before determining linearized, small-signal models for each of the circuit’s nonlinear components. The resulting linear circuit is next examined across a user-specified frequency range. Typically, a transfer function is the desired result of an AC small-signal analysis (voltage gain, transimpedance, etc). If there is just one AC input in the circuit, it is practical to set it to unity and zero phase such that the output variables have the same value as their transfer function to the input. A DC sweep and AC analysis can then be used in tandem to perform an alternating current analysis at each position under various bias conditions.
3D Heat Transport Solver
Deploy Lumerical HEAT to reliably, and systematically, address your engineer’s needs for heat simulation. A finite-element heat transfer and Joule heating solver are included in the 3D heat transfer simulation to emulate the thermal conductive, convective, and radiative effects on the optical properties of your device.
For steady-state and transient simulation, Lumerical HEAT provides a 2D/3D finite element heat transfer solver.
Self-consistent charge and heat transport simulation is offered by Lumerical HEAT. HEAT can be used in tandem with other Lumerical solutions to conduct multiphysics simulations:
Flexible implementation capable of capturing thermal optical and electro-optical effects.
Automatic mesh refinement catered to Finite Element IDE, based on geometry, materials, doping, refractive index, and optical or heat generation.
With more than 500 adjustable electronic and thermal properties, the material database enables precise modeling of complicated effects, and scriptable material properties, Lumerical HEAT offers a flexible visual database.
3D Electromagnetic (EM) Simulator
The core engineering framework of 3D electromagnetic simulations in Lumerical DGTD are accuracy and performance. A finite element Maxwell’s solution based on the discontinuous Galerkin time domain approach is deployed to handle the most difficult classes of nanophotonic simulations. The powerful solvers offered by DGTD (Discontinuous Galerkin Time Domain) can be used to model and optimize new designs in a variety of fields, such as magneto-optics, augmented reality, micro-LEDs, and lasers.
Several multiphysics simulations are offered by Ansys Lumerical DGTD in addition to other Lumerical solutions:
Finite Element Waveguide Simulation
Lumerical FEEM’s finite element Maxwell’s solver, which is based on the Eigenmode expansion algorithm, offers superior accuracy and performance scaling. Seamlessly calculate and analyze the modes that the 2D cross-section of waveguides or fibers can support in the frequency range.
Optically propagate a signal through a metal tine or another wave path in Ansys FEEM by seamlessly deploying oscillators. To gauge soil moisture, the difference in frequency between the output wave and the return wave is monitored.
Traditional time domain reflectometry (TDR), which is best suited for locating open and short circuit situations in conductors, may not be as sensitive to cable degradation as the FDR method due to its inherent benefits.
Because there are filtering and noise-reducing techniques in the frequency domain, for instance, FDR is less vulnerable to electrical noise and interference. Increased sensitivity and accuracy may result from this.
Additionally, since TDR pulses may have trouble moving forward after numerous noteworthy reflections, FDR analysis in FEEM is better suited for locating and describing a series of multiple deterioration episodes in lengthy cables.
In Ansys FEEM, The Fourier Transform and Plot/Modify Input Signal dialog boxes allow engineers to set several different functions for the x and y axes, apply different FFT windowing techniques, and set various output options.
Acting as a tool for signal decomposition for further filtration, engineers can visualize the material separation of the various signal components. This process of bridging the gap between these two worlds (time and frequency domain) is paramount to RF engineers.
Engineers can easily apply the various Discrete Fourier Transform calculation methods using FEEM, starting with the application of the Fourier Transform, moving on to the simplified calculation technique, and concluding with the Cooley-Tukey method of the Fast Fourier Transform.
Engineers can use the (n,k) Material import object in Ansys FEEM to transform spatially variable stress or strain into a spatially variable refractive index profile.
It is crucial to distinguish between circumstances that will cause diagonal anisotropy and those that won’t when introducing the spatially variable refractive index owing to stress or strain. Using a nk import material, which is accessible in Ansys FEEM, FDTD, and MODE, it is simple to address the diagonal anisotropy that is the focus of this example.
It will be essential to diagonalize the permittivity tensor and perform a matrix transformation to add the influence of the strain if the stress or strain produces a permittivity tensor with off-diagonal elements. Matrix transformation makes it simple to set up the matrix transform grid properties and specific stress inputs while also providing engineers with visual assistance to help them choose the best application.
Quantum Well Gain Simulation
Band structure, gain, and spontaneous emission across multi-quantum well architectures can be quantitatively characterized by simulating quantum mechanical activity in atomically thin semiconductor layers. To enable the construction of lasers, SOAs, electro-absorption modulators, and other gain-driven active devices, MQW couples to Lumerical CHARGE, MODE, and INTERCONNECT.
Engineers can effectively measure band structure, gain, and spontaneous emission in multi-quantum well devices thanks to Ansys Lumerical MQW, which simulates quantum mechanical activity in atomically thin semiconductor layers.
Additionally, MQW offers a fully-coupled k.p approach calculation of the quantum mechanical band structure.
Produce dynamic laser models that incorporate tuning and outside feedback effects into account, simulate and extract important TWLM (Travelling Wave Laser Model) parameters, and analyze steady-state and transient laser performance.
The design and manufacture of MQW lasers are typically complex and expensive; hence, simulations can speed up development and provide information on design factors.
Additionally, when the parameters are changed, measured curves and simulated power curves can be contrasted. It is possible to closely analyze issues like nonradiative recombination and self-heating that affect how well the simulated laser works.
Engineers utilizing MQW can use the time-dependent Ginzburg-Landau equations to numerically solve the mesoscopic superconducting ring constructions (through finite-element analysis).
Mimic the dynamic behavior of complex magnetic vortices in the semiconductor for a given applied magnetic field.
Users can also look into the many vortex configurations, pinpoint the best vortex states using the two stable vortex shells in the mesoscopic superconducting ring. And finally, assess the improved photonic surface superconductivity.
Optical Thin-Film Simulation
With Lumerical STACK, thin film stacks can be designed quickly. STACK is faster than direct simulations of the Maxwell’s equations since it makes use of analytical techniques. Interference and microactivity effects are accurately captured by the various thin film, photonic modeling software features under both plane-wave and dipole illumination.
In comparison to a direct simulation of Maxwell’s equations, the STACK Analytic solver is quicker. It has functionality for both plane-wave and dipole illumination and is excellent for rapid prototyping for thin film applications. Interference and microcavity effects are captured by the solver.
Through the Automation API, Python and MATLAB APIs, as well as the Lumerical scripting language, Lumerical STACK products are flexible and easy to integrate into workflows.
Seamless transition between on-axis and off-axis illumination is available for engineers in Ansys STACK who often toggle between multiple resolutions and proximity corrections.
One of the three main resolution-enhancement technologies, off-axis illumination (OAI), has allowed optical lithography to push the practical resolution limitations well beyond what was previously thought to be conceivable (the others being phase shifting masks and optical proximity corrections). Off-axis lighting must be properly sized and shaped for the particular mask pattern being printed in order to be used efficiently for engineers in this line of work.
Supporting Ansys Lumerical INTERCONNECT video materials showcasing functionality, and practical industrial application.