Contact UsJoin Ansys for an in-depth exploration of Ansys Sherlock’s latest capabilities for 2025 R1 and highlights around electronics reliability and Ansys Mechanical.
ABOUT THIS WEBINAR:
This latest update enhances your ability to predict the reliability of electronic components using advanced thermal-mech life predictions for BGA packages. Using an FEA-based approach, this new workflow helps account for system-level effects and additional behaviors, providing further insights into solder joint fatigue studies. This release also includes PySherlock updates with new APIs and automation capabilities. You will also benefit from general performance enhancements that refine the user experience and boost simulation efficiency.
DATE: March 5th, 2025
TIME: 11 AM EST
LOCATION: Virtual
WHAT YOU WILL LEARN:
- Thermal-Mech Life Predictions for BGA Packages
- PySherlock Updates
- Sherlock-Workbench and Sherlock Performance Enhancements
WHO SHOULD ATTEND:
- PCB Designers
- Reliability Engineers
- Mechanical Engineers
- Thermal Engineers
- PCB Reliability Engineers
SPEAKER:
Kelly Morgan