Get StartedMany problems require alterations of via or component placement, trace routing, or the plane metallization itself, all of which prove difficult to manage on the bench.
We can quickly examine the full gamut of board-related electrical issues within minutes and help cut down the number of prototype cycles needed to produce a working design. These span areas as wide as DCIR analysis (even coupling to mechanical and thermal results), power integrity, signal integrity, EMI, and many more.
Common applications include the following:
DCIR analysis
DCIR power loss analysis
DCIR analysis
Power integrity analysis, such as optimal PDN routing and decoupling capacitor placement
Signal integrity analysis
Near and far field radiated emissions
Near field distribution of large PCB assembly
Radiated susceptibility
20GHz Incident wave effects on PCB assembly in enclosure
Enclosure design
Enclosure design
