Contact UsOptimize thermal performance in your electronic designs to safeguard against failure and ensure reliability. Register now for faster, smarter modeling solutions!
ABOUT THIS WEBINAR:
Access cutting-edge electrothermal simulation strategies in this expert-led webinar that dives deep into the leading-edge capabilities of Ansys Icepak and Ansys Discovery, reshaping how engineers innovate and simulate their electronics product designs. Experience how real-time multiphysics simulations fuel your ability to explore, test, and refine your designs faster during the earliest stages of development.
DATE: June 24, 2025
TIME: 1 PM EDT
LOCATION: Virtual
WHAT YOU WILL LEARN:
- Analyze and Optimize Electronics Cooling Early: Leverage real-time simulation to evaluate and refine, in the design concept stage, your thermal management strategies
- Modify Designs Instantly with Direct Modeling: Make quick, intuitive changes to your geometry without the constraints of traditional modeling
- Connect Your Workflow with Seamless Integration: Maintain a smooth digital thread from initial simulation in Discovery to thermal signoff in Icepak, ensuring accuracy and consistency throughout your process.
WHO SHOULD ATTEND:
- Mechanical Engineers
- Thermal Engineers
- Electrical Engineers
- Package & IC Designers
- Ansys Icepak and Ansys Discovery Users
- Design Engineers
- Simulation Engineers Involved in Electronics Design
SPEAKER:
Carlos Gomez, Viral Gandhi, and Ethan Thompson