Ansys Icepak is the leading simulation software for electronics thermal management. In this Electronics Thermal Management Training, engineers will learn how to use Ansys Icepak to model airflow, temperature and heat transfer within IC packages, PCBs, electronic assemblies, electronic enclosures, and power electronics.
Module 1: Introduction and Overview
Module 2: Interface Modeling Basics
Module 3: Flow and Thermal Boundary Conditions
Module 4: Meshing
Module 5: Solving and Post-Processing
Module 6: Electro-Thermal Analysis
Module 7: Advanced Meshing
Module 8: Optimetrics