Ansys Sherlock Automated Design Analysis for Product Life Prediction.
In the early stages of design, Ansys Sherlock automated design analysis offers quick and accurate life predictions for electronic hardware at the component, board, and system levels. Ansys Sherlock bypasses the ‘test-fail-fix-repeat’ cycle by empowering designers to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs) and assemblies to predict failure risks due to thermal, mechanical and manufacturing stressors–all before prototype.
- Validated Time-To-Failure Predictions
- Rapid ECAD to FEA Translation
- Ansys Icepak & Mechanical Integrated Workflow
- Complete Product Lifetime Curve
Ansys Sherlock Capabilities
Electrical, mechanical, reliability engineers and more can work in tandem to implement design best practices, predict product lifetimes and reduce failure risks.
By practically running thermal cycling, power-temperature cycling, vibration, shock, bending, thermal derating, accelerated life, natural frequency, CAF, and other tests, Ansys Sherlock eliminates costly build-and-test iterations, allowing you to change designs in near real-time and achieve certification in one round. Ansys Sherlock can forecast test performance, estimate warranty return rates, and make Icepak and Mechanical users more effective by directly linking simulation to material and manufacturing costs when post-processing simulation results from Icepak and Mechanical.
Ansys Sherlock Key Features
With a full and rigorous lifetime curve, Ansys Sherlock’s post-processor decides time to failure, minimizing the number of required physical testing iterations and increasing the chances that prototypes can pass validation tests in the first round.
Ansys Sherlock gives users complete control over how they predict solder fatigue activity. The software’s completely validated 1D solder model predicts solder fatigue reliability for all electronic parts in thermomechanical and mechanical environments (die attach, BGA, QFN, TSOP, chip resistor, through hole, etc.)
As a function of ambient temperature, temperature rise due to power dissipation, and electrical loads, Ansys Sherlock predicts thermal failure rate and end of life for multiple component technologies.
Ansys Sherlock reliably predicts the failure actions of electronic hardware and components using Physics of Failure and Reliability Physics techniques, providing users with actionable findings to refine their product designs.
ECAD to CAE
Ansys Sherlock is the leading industry tool for converting a range of ECAD files into simulation-ready finite element models.
Ansys Sherlock recognizes your files and imports your parts list using its comprehensive parts and materials libraries (part, kit, materials, solder, laminate, and more). In minutes, it creates a 3D finite element analysis (FEA) model for your circuit board.
The intuitive user interface of Ansys Sherlock enables even novice users to add additional functionality to their PCBA model before simulation.