Addressing Electronics Reliability with Next-Generation Electronic Systems

Next-Generation Electronic Systems in Ansys | Webinar Description:

Significant challenges exist to deliver next-generation electronic systems. Traditional Design-Build-Test-Fail-Fix no longer works in the electronic product development cycle for the following reasons:

• Requires too many engineering resources
• Delays time-to-market (TTM), critical for 21st century designers and manufacturers
• Costs of finding/fixing issues after build are much higher than at design stage


OEMs spend 73% of product development costs on the Test-Fail-Fix portion of the cycle alone.


Next-Generation Electronic Systems in Ansys | Electronic Simulation

Ansys, a leader in Engineering Simulation, has the most comprehensive solution for electronics reliability challenges.

Whether investigating Electromagnetic behavior (Signal Integrity, Power Integrity, EMI/EMC), improving cooling strategies for increased Thermal Integrity…

…Or, assessing Mechanical Reliability and Robustness of electronic systems subjected to harsh environments (thermal cycling, drop, shock, and vibration), Ansys has solutions to help you deliver on your product promise of performance, faster time-to-market, and lower cost.

Learn more about Ansys Icepak and Ansys Sherlock.

Ansys-Sherlock-Thermal-Mapping- Plaform-Screenshot

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