Contact UsAnsys Icepak
Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.
Icepak Simulation Software
Electronics Cooling & PCB Thermal Simulation and Analysis
For thermal and fluid flow studies of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies, Ansys Icepak offers powerful electronic cooling solutions that use the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver. The graphical user interface for Icepak’s CFD solver is Ansys Electronics Desktop (AEDT) (GUI).
- Unstructured, Body-fitted Meshing
- High-fidelity CFD Solver
- Comprehensive Thermal Reliability Solution
- Industry Leading Multiscale Multiphysics
Ansys Icepak Capabilities
Icepak makes it easier to solve today’s most difficult thermal management problems in electronics devices and assemblies by providing CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces. Icepak’s advanced CAD healing, simplification, and metal fraction algorithms shorten simulation times while delivering highly accurate results that have been tested against real-world products. The highly automated, advanced meshing and solver schemes, which ensure a true representation of the electronics application, are responsible for the solution’s high level of accuracy.
Ansys Icepak Key Features
Meet Ansys’ industry-leading computational fluid dynamics (CFD) solutions. In addition, chip-level thermal integrity simulation tools, offering engineers everything required to conduct electronics cooling simulation. This includes, thermal analysis for chip-package, PCB, and systems-level simulations.
Moreover, engineers may also perform a thermomechanical stress analysis and corresponding airflow analysis’. Crucially, this ensures designers can find the best heat sink or fan type for your needs. Finally, users can undertake design trade-offs with our streamlined workflow, resulting in increased reliability and performance.
Icepak can reliably predict temperature rise using specific geometries and electrical inputs. That is, thanks to a tight synergy with SIwave, Ansys Mechanical, and Sherlock.
Icepak users can quickly put together automated workflows for electromigration and dielectric breakdown. In addition, multi-axial solder joint fatigue within the Ansys ecosystem.
Electronic devices’ efficiency and reliability can be harmed by heat.
Thermal analysis relies heavily on IC power dissipation and power losses across the board.
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Ansys Icepak provides electronic cooling solutions that utilize the industry leading CFD solver for T&F flow analyses of integrated circuits, PCBs and electronics.
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