Next-Generation Electronic Systems in Ansys | Webinar Description:
Significant challenges exist to deliver next-generation electronic systems. Traditional Design-Build-Test-Fail-Fix no longer works in the electronic product development cycle for the following reasons:
• Requires too many engineering resources
• Delays time-to-market (TTM), critical for 21st century designers and manufacturers
• Costs of finding/fixing issues after build are much higher than at design stage
OEMs spend 73% of product development costs on the Test-Fail-Fix portion of the cycle alone.
Next-Generation Electronic Systems in Ansys | Electronic Simulation
Ansys, a leader in Engineering Simulation, has the most comprehensive solution for electronics reliability challenges.
Whether investigating Electromagnetic behavior (Signal Integrity, Power Integrity, EMI/EMC), improving cooling strategies for increased Thermal Integrity…
…Or, assessing Mechanical Reliability and Robustness of electronic systems subjected to harsh environments (thermal cycling, drop, shock, and vibration), Ansys has solutions to help you deliver on your product promise of performance, faster time-to-market, and lower cost.
Learn more about Ansys Icepak and Ansys Sherlock.
Additional Ansys Software Tips & Tricks Resources
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- Analyzing normal and Tangential Elastic Foundations in Mechanical
- Why Meshing is Crucial for FEA Fluid Simulations Prior to Prototyping
- For support on Contained Fluid FEA Modeling with HSFLD242 Elements
- For Exporting a Deformed Geometry Shape Post-Analysis in Mechanical
- Moreover, for guidance Multi-Step Analyses in Mechanical
- For Retrieving Beam Reaction Force in a Random Vibration Analysis
- Deploying Ansys Macro Programming vis *USE Command in Mechanical
- For replicating Fatigue Models from Start to Finish in Mechanical
- In addition, setting up Acoustic Simulations of a Silencer
- For a step-by-step guide on 2D to 3D Submodeling in Mechanical
- For modeling Pipe16 Circumferential Stress in Mechanical
- For Support on performing ‘EKILL‘ in Workbench
- APDL Command Objects post-Spectral Analysis
- For Separating DB Database Files from RST Files
- Measuring Geometric Rotation in Mechanical WB
- Explicitly, CAD Geometry Deformation Plasticity
- Offsetting a Temperature Result to Degrees Absolute
- For general guidance on Ansys Post-Processing
- Finally, for basic Ansys Software Installation and License Manager Updates